無塵棉籤在晶片製造過程中的使用

首先, 我們先了解晶片的製造流程. 晶片的製造過程大致可分為晶圓加工等幾個步驟, 晶圓引腳測試, 建造, 和測試. 他們之中, the wafer processing process and the wafer pin testing process are the front-end processes, and the assembly process and the test process are the back-end processes.
然而, dust is easily generated during the chip packaging process. This dust is fatal to the chip, it can not only affect the quality of the chip, but also affect the life of the chip. In the process, if there is dust, use a clean cotton swab to clean it. The clean cotton swab can not only clean the dust, but also play an antistatic role.
For the entire chip manufacturing process, the assembly process is very important. It is to fix a single die on a plastic or ceramic chip base, and connect some lead terminals etched out of the die with the protruding pins at the bottom of the base to connect with external circuit boards. 最後, 蓋上塑膠蓋並用膠水密封. 目的是保護模具免受機械刮傷或高溫損壞. 在此刻, 它被認為是一個集成電路晶片 (那是, 我們在計算機中看到的黑色或棕色的矩形小塊, 兩側或四側有許多引腳或引線).
在施工過程中, 灰塵必須用乾淨的棉花棒擦拭. 因為晶片比較小, 不適合與其他產品（例如濕紙巾）一起清潔.