Việc sử dụng tăm bông không bụi trong quá trình sản xuất chip

Đầu tiên, lần đầu tiên chúng tôi hiểu quy trình sản xuất chip. Quá trình sản xuất chip có thể được chia đại khái thành nhiều bước như xử lý wafer, kiểm tra pin wafer, sự thi công, và thử nghiệm. Trong số họ, the wafer processing process and the wafer pin testing process are the front-end processes, and the assembly process and the test process are the back-end processes.
Tuy nhiên, dust is easily generated during the chip packaging process. This dust is fatal to the chip, it can not only affect the quality of the chip, but also affect the life of the chip. In the process, if there is dust, use a clean cotton swab to clean it. The clean cotton swab can not only clean the dust, but also play an antistatic role.
For the entire chip manufacturing process, the assembly process is very important. It is to fix a single die on a plastic or ceramic chip base, and connect some lead terminals etched out of the die with the protruding pins at the bottom of the base to connect with external circuit boards. Cuối cùng, cover the plastic cover and seal it with glue. The intention is to protect the die from mechanical scratches or high temperature damage. At this point, it is considered to be an integrated circuit chip (that is, the rectangular small blocks that are black or brown that we can see in the computer, with many pins or leads on both or four sides).
In the construction process, the dust must be wiped with a clean cotton swab. Because the chip is relatively small, it is not suitable for cleaning with other products such as wipes.